a. If one of the technologies identified in Table 9‑1 is used in spacecraft and planetary-mission systems, the SEE probability and effects shall be analysed.
NOTE 1 As specified in Clauses 7, 8 and 10, the susceptibility of many of these components is also analysed for other radiation effects (such as total ionising dose and displacement damage).
NOTE 2 As technologies evolve and new phenomena are identified, it can be the case that this table does not fully represent the technologies and effects.
NOTE 3 Derating is employed in the RHA programme to ensure that the device operates in a manner so as to be insensitive to SEE effects.
Table 9‑1: Possible single event effects as a function of component technology and family.
Component type |
Technology |
Family |
Function |
SEL |
SESB |
SEGR |
SEB |
SEU |
MCU/SMU |
SEDR |
SEHE |
SEFI |
SET |
SED |
Transistors |
Power MOS |
|
|
|
|
X |
X |
|
|
|
|
|
|
|
ICs |
CMOS or BiCMOS or SOI |
Digital |
SRAM |
X* |
|
|
|
X |
X |
|
X |
|
|
|
|
|
|
DRAM/ SDRAM |
X* |
X |
|
|
X |
X |
|
X |
X |
|
|
|
|
|
FPGA |
X* |
|
|
|
X |
|
X |
|
X |
|
X |
|
|
|
EEPROM/ Flash EEPROM |
X* |
|
|
|
|
|
X |
|
X |
|
X |
|
|
|
μP/ μcontroller |
X |
|
|
|
X |
|
|
X |
X |
|
X |
|
|
Mixed |
ADC |
X* |
|
|
|
X |
|
|
|
X |
X |
X |
|
|
Signal |
DAC |
X* |
|
|
|
X |
|
|
|
X |
X |
X |
|
|
Linear |
|
X* |
|
|
|
|
|
X |
|
|
X |
|
|
Bipolar |
Digital |
|
|
|
|
|
X |
|
|
|
|
X |
|
Linear |
|
|
|
|
|
X |
|
|
|
|
X |
|
||
Opto-electronics |
|
|
Opto-couplers |
|
|
|
|
|
|
|
|
|
X |
|
|
|
CCD |
|
|
|
|
|
|
|
|
|
X |
|
|
|
|
|
APS (CMOS) |
X |
|
|
|
|
|
|
|
X |
X |
|
*except SOI |