Table 4‑3: Summary of radiation effects and cross-references to other chapters

(Part 1 of 2)

Sub-system or component	Technology	Effect	ECSS-E-ST-10-12 main clause cross-reference	ECSS-E-HB-10-12 Section cross-reference
Integrated circuits	Power MOS	TID SEGR SEB	7 9.4.1.6 9.4.1.6	6 8.6.2 8.6.3
	CMOS	TID SEE (generally)	7 9	6 8
	Bipolar	TNID SEU SET TID	8 9.4.1.2, 9.4.1.3 9.4.1.7 7	7.4.2 8.7.1 8.7.5 6
	BiCMOS	TID TNID SEE (generally)	7 8 9	6 7.4.2 8
	SOI	TID SEE (generally exc. SEL)	7 9	6 8
Optoelectronics and sensors (1)	MEMS ^a	TID	7	6
	CCD	TNID TID Enhanced background (SEE)	8 7 10.4.2, 10.4.3, 10.4.5	7.4.3 6 9.2, 9.4
	CMOS APS	TNID TID SEE (generally) Enhanced background	8 7 9 10.4.2, 10.4.3, 10.4.5	7.4.4 6 8 9.2, 9.4
	Photodiodes	TNID TID SET	8 7 9.4.1.7	7.4.5 6 8.7.5
	LEDs	TNID TID	8 7	7.4.7 6
	laser LEDs	TNID TID	8 7	7.4.7 6
	Opto-couplers	TNID TID SET	8 7 9.4.1.7	7.4.8 6 8.7.5